Flip-Chip Bonding Jobs
Browse 46 Flip-Chip Bonding jobs on Inference Jobs.
46 jobs
3dCE
Advanced Packaging Technologist & Lead
Cerebras
Sunnyvale, California, United States (On-site)$175k – $275k Yearly
3wNV
Senior Package Layout Engineer - Hardware
NVIDIA
Santa Clara, California, United States (Hybrid)$136k – $258.8k Yearly
3dNV
CPO Integration Engineer - LPU Packaging
NVIDIA
Santa Clara, California, United States (On-site)$140k – $276k Yearly
2wNV
5dOP
Advanced Packaging Technologist
OpenAI
San Francisco, California, United States (On-site)$266k – $445k Yearly
2wNV
Chip Engineering Operations Program Manager
NVIDIA
Santa Clara, California, United States (On-site)$136k – $258.8k Yearly
2wTE
SoC Top-Level Physical Design Engineer
Tenstorrent
Austin, Texas, United States (Hybrid)$100k – $500k Yearly
2wNV
Chiplet Physical Design Engineer
NVIDIA
Westford, Massachusetts, United States (On-site)$168k – $310.5k Yearly
2wNV
Principal Digital Design Engineer
NVIDIA
Santa Clara, California, United States (On-site)$232k – $368k Yearly
3dNV
Senior System Software Engineer - CUDA Chips
NVIDIA
Santa Clara, California, United States (On-site)$152k – $287.5k Yearly
5dNV
Senior SoC Methodology Architect, VLSI Physical Design
NVIDIA
Santa Clara, California, United States (Hybrid)$136k – $218.5k Yearly