3D Multi-die Packaging Jobs
Browse 15 3D Multi-die Packaging jobs on Inference Jobs.
15 jobs
3d ago
NV
NVSenior Package Modeling Engineer
NVIDIA
Santa Clara, California, United States (Hybrid)$124K – $195.5K Yearly
2w ago
TE
TEPhysical Design Engineer: Die-to-Die Interface (RTL to GDSII)
Tenstorrent
United States (Remote)$100K – $500K Yearly
3d agoNV
NVSenior Power Integrity Engineer - LPU Packaging
NVIDIA
Santa Clara, California, United States (On-site)$196K – $368K Yearly
1w ago
GR
GRSenior Semiconductor Reliability Engineer – Advanced Silicon & Packaging
Graphcore
Bristol, England, United Kingdom (On-site)
3d ago
FI
FIConnector & Interconnect Design Engineer
Figure
San Jose, California, United States (On-site)$145K – $200K Yearly