DCP-Power Electronical HW Engineer(Global)-Shenzhen

Brief Job Description: 
Senior Power Electronics Engineer (Shenzhen)
Location: Shenzhen, China
Company: Foreign-invested enterprise
Responsibilities
1.    Power Electronics Product Development
o    Lead the design and development of power electronics products, such as inverters, converters, charging modules, and power management systems.
o    Responsible for topology design, component selection, magnetic component design, and thermal design to ensure system performance and reliability.
2.    Technical Verification & Testing
o    Plan and perform electrical performance, safety, and EMC tests; drive prototype validation and functional debugging.
o    Analyze and resolve technical issues related to electrical design, thermal management, and EMI/EMC during the development process.
3.    Project Management & Cross-functional Collaboration
o    Participate in project initiation and technical evaluation, define development plans, and ensure on-time delivery.
o    Collaborate closely with global R&D teams, suppliers, and manufacturing teams to support the entire product lifecycle from R&D to mass production.
4.    Standards & Compliance
o    Ensure designs comply with international and domestic standards (e.g., IEC, UL, GB).
o    Stay up to date with industry trends, advanced technologies, and new components in the field of power electronics, and apply them to product development.
5.    Team Support & Guidance
o    Provide technical coaching and training to junior and mid-level engineers.
o    Participate in technical reviews and intellectual property development (e.g., patents), contributing to overall R&D capability enhancement.
Qualifications
•    Master’s degree or above in Power Electronics, Electrical Engineering, Automation, or related fields.
•    5+ years of experience in power electronics product development; background in high-power supplies, PV/storage inverters, EV chargers, or automotive powertrain electronics is a plus.
•    Solid knowledge of common power electronics topologies (e.g., Buck/Boost, LLC, Full-Bridge, Three-Level). Skilled in magnetic component design and thermal simulation.
•    Proficient in applying and driving power devices (IGBT, SiC, GaN).
•    Strong English communication skills, capable of working effectively with overseas R&D teams.
•    Excellent problem-solving, analytical, and innovative thinking skills.