NVIDIA is changing the world with its relentless focus on the accelerated computing that has launched the AI revolution. We continue to deliver accelerated computing solutions to ever growing field of applications such Robotics, Autonomous Driving, Genetics, Finance and Professional Visualization. NVIDIA has been transforming computer graphics, PC gaming, and accelerated computing for more than 30 years. We provide an incredible mix of uniquely talented people who provide technology solutions that have a lasting impact. As an NVIDIAN, you’ll be immersed in a diverse, supportive environment where everyone is inspired to do their best work every day. Come join the team and experience the company which is driving the AI revolution.
NVIDIA Operations team is turbocharging our continuous product volume and revenue growth through speed of light execution and creative supply chain/technology solutions. NVIDIA’s Operations team is looking for a Senior Supplier Manufacturing Engineer, OSAT Assembly Manufacturing Operations. We need someone who has a solid technical background as well as an excellent reputation with our manufacturing partners. You will be reporting to Director of IC Supply Chain and Manufacturing.
What you'll be doing:
Drive new product and new technology introduction into high-volume manufacturing (HVM)
Develop purchasing and configuration specifications for advanced FCBGA and 2.5D assembly/metrology equipment
Define equipment and metrology technology roadmap and partner with suppliers to enable HVM readiness
Assess equipment capacity limitations against product requirements and implement optimization strategies
Lead continuous improvement initiatives to enhance yield, cycle time, and product quality/reliability
Resolve manufacturing execution and quality issues through systematic and scalable solutions
Deliver data automation solutions to improve visibility and decision-making
What we need to see:
Master’s degree or higher in Engineering or Science with emphasis on Mechanical, Materials Science, Chemical Engineering fields (or equivalent experience)
Familiar with semiconductor equipment acceptance processes which includes technical specifications (Spec), hardware acceptance (installation inspection), software acceptance (functional operation), and process acceptance (yield, throughput and reliability)
8+ year validated experience in Flip Chip semiconductor packaging process and equipment development. Hands on factory floor experience in operating equipment used in 2.5D packaging is preferred
Thorough understanding of chip assembly equipment design --- knowledge of materials, process, substrate/package design in chip assembly operations. Experience with PCB assembly is a plus
Extensive project management and OSAT management experience
Strong statistical analysis skills – ability to use data visualization techniques to deliver decisions
Deep understanding of quality control, statistics process control, gage R&R and DOE techniques
Knowledge of FCBGA/2.5D/3D packaging industry and its supply chain
Excellent written and oral communication skills
With competitive salaries and a generous benefits package, NVIDIA is widely considered to be one of the most desirable employers in the world. We have some of the most brilliant and talented people in the world working for us. If you are creative, autonomous and love a challenge, we want to hear from you. We are an equal opportunity employer and value diversity at our company. We do not discriminate on the basis of race, religion, color, national origin, gender, sexual orientation, age, marital status, veteran status, or disability status.
#LI-Hybrid