NVIDIA Networking IC Product Engineering team is looking for a highly skilled IC physical failure analysis (PFA) engineer to join our growing team and support PFA activities for yield improvement, product bring-up, customer returns, and product qualification. As a PFA engineer, you will own the physical failure analysis (PFA) part, develop work procedures/techniques/recipes, and perform PFA of IC’s using in-house equipment and in external labs.
What You Will Be Doing:
Opera
te dual-beam PFIB and develop workflows for the following applications:
Site-specific cross-sectioning
TEM sample preparation
IC delayer
Large scale cross-sections
Unique sample preparation for different probing and imaging techniques
Use
SEM based nanoprobing techniques for fault isolation and device/cell characterization based on FA plan provided by the EFA engineers
EBAC/EBIC/EBRICH for fault isolation
Device and cell level measurements
Own and lead nanoprobing activities, including method development and execution. Continuously drive improvements, stay up-to date, and collaborate with vendors on new techniques.
Sample preparation for optical fault isolation, probing and more: use P-lapping and CNC for Si thinning and IC delayering
What We Need to See:
BSc in Materials/chemical engineering, physics, chemistry, or related fields
5+ years of relevant industry experience in IC package or die level Failure Analysis.
Ability to work and collaborate as part of a team and independently
Self-motivated with the ability to learn alone and review the literature to find solutions to our challenges.
Insist on high standards for high-quality samples
Good documentation and communication skills
Ways To Stand Out From The Crowd:
Good understanding of VLSI circuit design, and/or device physics, and/or IC process engineering
Experience with various IC delayering methods
Background with dual beam FIB for cross-sections and preparing lamella for TEM
Experience with SEM based nano-probing