We are seeking an experienced, analytical, and highly motivated engineer to lead CHIP and PCB NPI activities for Networking products. This role involves driving complex cross-functional efforts from early development stages through qualification and readiness for high-volume manufacturing. The ideal candidate will combine strong technical understanding with program management skills to coordinate multiple engineering disciplines and external manufacturing partners. Success in this role requires a proactive mindset, the ability to manage risks and solve technical challenges, and a strong focus on execution. As part of NVIDIA’s Networking organization, you will help ensure robust supply chain readiness and enable the successful launch of next-generation networking solutions.
What you'll be doing:
Lead CHIP/Substrate/OSAT/PCB qualification for Networking products (2nd source).
Collaborate with engineering teams to identify suitable Substrate suppliers based on technical capability and capacity and define the qualification plan.
Coordinate and lead changes through the ECR/CCB process.
Work with engineering teams to create the product BOM and plan initial qualification activities on the ASSY floor.
Track activities, manage timelines, and ensure successful qualification completion; support transition from qualification to mass production.
Develop and execute risk plans for material requirements prior to qualification completion.
Identify critical paths and bottlenecks; implement risk management methodologies.
Develop and implement project management processes to improve tracking, clarity, execution, and day-to-day operational efficiency.
Create and maintain systems for data management and task tracking using Power BI and other advanced systems, including AI-driven tools.
What we need to see:
B.Sc. in Industrial engineering, Material or Chemical engineering or a related field, or equivalent experience.
Strong engineering background with business and operations proficiency.
5+ years of proven experience in leading sophisticated, highly technology-intensive projects (Semiconductor– advantage).
Strong critical thinking, attention to detail, and strong decision-making skills.
Independent and proactive approach – being able to own a task but also to deep dive into the relevant details surrounding it.
Performs well in an intensive environment - Working hour flexibility (working with global parties).
Ability to manage schedule and meet deadlines.
Multitasking, good interpersonal skills and a great teammate.
Proficient in English – reading, writing, and speaking.
Microsoft Office tools - Excellent skills in Word, Excel, and PowerPoint tools.